DS-201A is a MacBook seeding platform, which is mainly used for seeding large BGA chips (including CPU, GPU, PCH)
DS-201B is a MacBook tin planting platform, which is mainly used for tin planting of small BGA chips (including PMU, SMC, T1, T2, ram, NAND, WiFi, power chip)
DS-201A (including 14 steel meshes, 14 steel mesh fixing seats and 1 magnet base)
8 9gen CPU / 0.45: 8 generation and 9 generation low voltage Intel CPU chip steel mesh, 0.45 tin ball
2 3gen CPU / 0.45: generation 2 and generation 3 low-voltage Intel CPU chip steel mesh, 0.45 tin ball
2 3gen i7 CPU / 0.4: generation 2 and generation 3 low voltage i7 Intel CPU chip steel mesh, 0.4 tin ball
6 7gen CPU / 0.45: 6th generation and 7th generation low voltage Intel CPU chip steel mesh, 0.45 tin ball
10 Gen CPU / 0.45: generation 10 low-voltage Intel CPU chip steel mesh, 0.45 tin ball
IMac GPU /0.45: IMAC graphics chip steel mesh, 0.45 tin ball
Amd GPU /0.45: AMD graphics chip steel mesh, 0.45 tin ball
NV GPU /0.45:nvidia NVIDIA NVIDIA graphics chip steel mesh, 0.45 tin ball
4 5gen CPU / 0.45: generation 4 and generation 5 low-voltage Intel CPU chip steel mesh, 0.45 tin ball
Sr217 15 /0.3:a1534 15 CPU chip steel mesh, 0.3 tin ball
4gen HQ CPU /0.45:4 generation standard pressure Intel CPU chip steel mesh, 0.45 tin ball
23gen PCH /0.35: 2nd generation and 3rd generation PCH Nanqiao chip steel mesh, 0.35 tin ball
6gen HQ CPU /0.45:6th generation standard pressure Intel CPU chip steel mesh, 0.45 tin ball
4gen PCH /0.35: 4th generation PCH Nanqiao chip steel mesh, 0.35 tin ball
